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The low melting point alloy and polymer composite can be used not only for the preparation of composite materials with high electrical conductivity, but also for the preparation of composite materials with high thermal conductivity. In Japan, high thermal conductivity plastics prepared by combining low melting point alloys with polymers have been successfully developed.Another form of polymer-based conductive composites that use a low melting point alloy as a conductive filler is an adhesive. In the electronics industry, in order to replace lead-containing solders, conductive adhesives composed of polymer collectives and conductive fillers such as silver sheets have been developed. However, such conventional conductive adhesives have high and unstable connection resistance and low impact strength. In order to improve it, a low-melting alloy was added to the conventional conductive adhesive to produce a new conductive adhesive. The connection structure of the new conductive adhesive was characterized by SEM, optical microscope, etc. The results showed that after the resin was cured, a metal connection was established between the conductive particles and between the conductive particles and the circuit. This new type of conductive adhesive has a much lower volume resistance than conventional conductive adhesives, especially the connection structure formed in the circuit has a lower initial continuous resistance, and a more stable connection resistance than using a conventional conductive adhesive, all in the conductive adhesive The use of a low melting point alloy as a conductive filler can reduce the adhesive resistivity and improve the connection conductivity. The combination of the low melting point alloy and the polymer can improve the processing property of the polymer. Under appropriate preparation conditions, the obtained composite material has high electrical conductivity and excellent mechanical properties. In other words, the price performance and performance of the material are perfectly unified. It is beyond any other filler system such as carbon black, carbon fiber, metal fiber, metal foil and so on. This shows that low melting point alloys are a very promising functional material.

low melting pointAt present, the main cooling technology is air cooling, heat pipe, water cooling and so on.Air cooling technology has limited thermal conductivity and can only be applied to low-power electronic products.The heat pipe is better than the air cooling, but there is the burning limit, and even the pipe rupture failure phenomenon;Due to evaporation, leakage and other problems in the process of operation, water-cooled cooling is easy to lead to device aging, and the requirements for liquid and flow pipe are also high.The radiator that liquid metal makes has the advantage that this traditional radiator cannot compare, that is collect efficient, compact, safe, quiet in an organic whole.It has good thermal conductivity and specific heat capacity, but the volume does not increase at all. The same volume brings better performance, and the compactness is vividly reflected.Liquid metal will not leak, not easy to evaporate, will not deteriorate, safe operation, long service life.Due to the built-in electromagnetic pump in the heat dissipation pipeline, the pressure gradient is generated by the electromagnetic force to push the liquid forward without any noise, so that users can enjoy the silent radiator.The alloy of gallium metal is used as the heat conducting agent of radiator, with low melting point, non-toxic and harmless, fast heat absorption and high boiling point.Liquid metal cooling technology can not only be applied toCPUcooling, its core technology can be extended to more aspects, including the instrument industry, steel manufacturing, solar energy capture, national defense, etc. Due to the wide application of various kinds of chips and optoelectronic devices, the corresponding cooling technology has a huge market demand.According to the data, the world market for manufacturing components such as fans and fins used in computer cpus, for example, is about $5 billion to $10 billion a year. With the increasing power consumption, the price of chipcoolingsolutions has also increased dramatically, and the corresponding market demand has also increased. This undoubtedly provides the broad development space for the liquid metal heat dissipation technology.

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