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Metal Thermal Pad

TIM-PAD-I

TIM-PAD-I

Composition BiSnIn
Thermal Conductivity >30W/m·K
Size 100mm X 50mm
Conductivity 3 X 10^6 S/m
Viscosity 59℃, phase-change material
Operating temperature -50℃~600℃
Volatilization rate <0.001%
Corrosive Non-corrosion

TIM-PAD-Pro

TIM-PAD-Pro

Composition BiSnInZn
Thermal Conductivity >45W/m·K
Size 100mm X 50mm
Conductivity 3 X 10^6 S/m
Viscosity 58℃, phase-change material
Operating temperature -50℃~600℃
Volatilization rate <0.001%
Corrosive Non-corrosion

TIM-PAD-Ultra

TIM-PAD-Ultra

Composition BiSnInAg
Thermal Conductivity >50W/m·K
Size 100mm X 50mm
Conductivity 3 X 10^6 S/m
Viscosity 58℃, phase-change material
Operating temperature -50℃~600℃
Volatilization rate <0.001%
Corrosive Non-corrosion

Product Description

This Metal Thermal Pad is made of 100% metal and melting point in range of 58℃ to 200℃ which can be melted to liquid form when heat source (CPU/GPU) temperature going to be higher than its melting point, then it will fill the gap between heat source (CPU/GPU) and heat radiator for fast cooling. And when the temperature is going be lower than its melting point, the liquid form will become solid pad. So it is phase change material with high performance of thermal conductivity and strong stability and reliability after long time operation. Its raw materials includes Indium, Tin, Bismuth, Zinc, Silver, Aluminum, etc, and the metal thermal pad can be made into various melting points and shapes according to customer’s requirement. Single metal foil (Indium foil, Tin foil), Binary Alloy foil, Ternary Alloy foil and Quaternary Alloy foil are also available, and thickness range can be 0.01mm to 5mm. It is certainly RoHS conformable and absolute nontoxic.

Product Usage

Santech can produce various size of metal pad in forms of rectangle, round, ring, triangle according to your requirements. It be putted directly between the heat source and heat radiator, and it can ensure long-term operational safety of heat dissipation systems for its strong stability and reliability. It is also used in sealing material, solder, etc.

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